MM&T-Ceramic Metal Substrates for Hybrid Electronics: Handbook

The Handbook is a compilation of data and other relevant information obtained in the course of an 18-month program, details of which were presented in the final report published in August, 1983. The various known constructions of insulated metal (IM) substrates are described. The properties of porce...

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Bibliographische Detailangaben
Hauptverfasser:	Timberlake, A B, Merti, F E
Format:	Report
Sprache:	eng
Schlagworte:	Ammunition and Explosives BIBLIOGRAPHIES CERAMIC MATERIALS Ceramics, Refractories and Glass ELECTRIC CONDUCTORS ENAMELS FABRICATION Fabrication Metallurgy FUZES(ORDNANCE) HYBRID CIRCUITS HYBRID SYSTEMS INSULATION LAMINATES Laminates and Composite Materials LEACHING LPN- HDL-80308A LPN-HDL-804082 LPN-PRON-810P1556M1A9 MANUFACTURING METHODOLOGY MICROELECTRONICS MMT(MANUFACTURING METHODS AND TECHNOLOGY) PLASMA SPRAYING POLYMERS RESISTANCE RESISTORS SOLDERING Solid State Physics STABILITY STEEL SUBSTRATES SYSTEMS ANALYSIS THICK FILMS
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Beschreibung
Zusammenfassung:	The Handbook is a compilation of data and other relevant information obtained in the course of an 18-month program, details of which were presented in the final report published in August, 1983. The various known constructions of insulated metal (IM) substrates are described. The properties of porcelain- enameled steel (PES) substrates relevant to high-volume manufacture of thick- film hybrid microelectronic assemblies are presented. Typical properties of thick film conductors and resistors fired on PES substrates are described. Comparisons with alumina substrate materials are made. Wire bondability, solder back leach resistance, dependence of resistor properties on resistor geometry, and resistor stability data are presented. Thick-film and hybrid assembly experience with PES substrates are discussed. A bibliography citing numerous articles on PES, plasma-sprayed ceramic on metal, polymer thick film materials, and organic-metal laminates is included.