The Development of the Equipment and Technique for Welding the Leads of Integrated Circuits to Printed Circuit Boards

At the present time, solder with a low melting point and flux is used for attaching integrated circuits leads to printed circuit plates in industrial procedures. However, a number of difficulties are involved in this method, and there is a tendency to replace it with better welding processes such as the one proposed in this article. The basic principle here is that the voltage on the welding electrodes is automatically controlled, and the increase or decrease in the cross sections of the elements to be joined are automatically compensated by the increase or decrease in the welding current. The full schematic of the equipment is given together with details of the best use of the method for various materials to be welded. The authors conclude that this new method forms stable joints with nickel printed circuit leads. (Author) Edited machine trans. of Pribory i Sistemy Upravleniya (USSR) n10 p52-54 1970, by Henry Peck.