MICROMINIATURE MONOLITHIC CROSSPOINT INTERCONNECTIONS

The report describes the techniques used for fabricating a 1 x 4 microminiature crosspoint. It also presents results from electrical tests made on 1 x 1 and 1 x 4 crosspoints. A general discussion of process steps for manufacturing beam-lead diodes is given, followed by descriptions of the depositio...

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Hauptverfasser:	Yuan,S, Buchsbaum,W H, Kalet,M, Spann,L
Format:	Report
Sprache:	eng
Schlagworte:	CHROMIUM CIRCUIT INTERCONNECTIONS DEPOSITION Electrical and Electronic Equipment ETCHING INTEGRATED CIRCUITS MANUFACTURING MICROELECTRONICS PACKAGING RESISTORS SEMICONDUCTOR DIODES SILICON SWITCHING CIRCUITS ULTRASONIC WELDING
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Beschreibung
Zusammenfassung:	The report describes the techniques used for fabricating a 1 x 4 microminiature crosspoint. It also presents results from electrical tests made on 1 x 1 and 1 x 4 crosspoints. A general discussion of process steps for manufacturing beam-lead diodes is given, followed by descriptions of the deposition and etching of chromium resistors and the gold interconnection patterns, mounting of monolithic logic chips, ultrasonic wire bonding, mounting of beam-lead diodes and the final packaging of a 1 x 4 crosspoint. (Author) See also AD-653 597.