The effective and sustainable application of a green amino acid-based corrosion Inhibitor for Cu metal

The human body is a remarkably aggressive medium and applied materials must be extremely resistant to corrosion and destruction, so copper, which is a biological material and is widely used in medicine, is being considered. Copper corrosion may be associated with inflammation in body because it rele...

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Veröffentlicht in:Chemical physics impact 2023-12, Vol.7, p.100316, Article 100316
Hauptverfasser: Jabbar, Abdullah Hasan, Kamona, Suhair Mohammad Husein, Abbood, Sarah Kamil, Hussein, Talib Kh, Al-Saidi, Dahlia N., Hameed, Safaa Mustafa, Rashid, Rashid Abdul Kareem, Abbas, Hussein Abdullah, Kadhim, Mustafa M.
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Sprache:eng
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Zusammenfassung:The human body is a remarkably aggressive medium and applied materials must be extremely resistant to corrosion and destruction, so copper, which is a biological material and is widely used in medicine, is being considered. Copper corrosion may be associated with inflammation in body because it releases ions that are toxic to humans. In aggressive solutions, biomolecules called amino acids act as corrosion inhibitors. In the present research, the purpose is to study the inhibitory action of l-alanine (L-Ala) and l-Leucine (L-Leu) amino acids on the corrosion of Cu. By density functional theory (DFT), inhibition behavior of l-Ala-and l-Leu-and their conformers against Cu corrosion have been investigated. According to values of back-donation of electrons (Eback-d), fraction of electron transferred (ΔN), electrophilicity (ω), electronegativity (χ), softness (σ), hardness (η), energy gap (Eg), ELUMO, and EHOMO computed reactivity factors between copper surface and inhibitors are studied. l-Leu's theoretical indicators confirm its tendency towards adsorption. l-Leu-activity against corrosion has been investigated and favorable results have been obtained. Related to densities of LUMO in molecules of inhibitor, which are prevalent to accept e- from d-orbitals of Cu to construct a back-donating bond. [Display omitted]
ISSN:2667-0224
2667-0224
DOI:10.1016/j.chphi.2023.100316