A high-fidelity quantum matter-link between ion-trap microchip modules

System scalability is fundamental for large-scale quantum computers (QCs) and is being pursued over a variety of hardware platforms. For QCs based on trapped ions, architectures such as the quantum charge-coupled device (QCCD) are used to scale the number of qubits on a single device. However, the n...

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Veröffentlicht in:Nature communications 2023-02, Vol.14 (1), p.531-531, Article 531
Hauptverfasser: Akhtar, M., Bonus, F., Lebrun-Gallagher, F. R., Johnson, N. I., Siegele-Brown, M., Hong, S., Hile, S. J., Kulmiya, S. A., Weidt, S., Hensinger, W. K.
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Sprache:eng
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Zusammenfassung:System scalability is fundamental for large-scale quantum computers (QCs) and is being pursued over a variety of hardware platforms. For QCs based on trapped ions, architectures such as the quantum charge-coupled device (QCCD) are used to scale the number of qubits on a single device. However, the number of ions that can be hosted on a single quantum computing module is limited by the size of the chip being used. Therefore, a modular approach is of critical importance and requires quantum connections between individual modules. Here, we present the demonstration of a quantum matter-link in which ion qubits are transferred between adjacent QC modules. Ion transport between adjacent modules is realised at a rate of 2424 s −1 and with an infidelity associated with ion loss during transport below 7 × 10 −8 . Furthermore, we show that the link does not measurably impact the phase coherence of the qubit. The quantum matter-link constitutes a practical mechanism for the interconnection of QCCD devices. Our work will facilitate the implementation of modular QCs capable of fault-tolerant utility-scale quantum computation. A possible route to scalability of trapped-ion-based quantum computing platforms is to connect multiple modules where ions can be shuttled across different registers. Here, the authors demonstrate fast and low-loss transfer of trapped ions between two microchip modules.
ISSN:2041-1723
2041-1723
DOI:10.1038/s41467-022-35285-3