Surface Energy Driven Cubic-to-Hexagonal Grain Growth of Ge2Sb2Te5 Thin Film

Phase change memory (PCM) is a promising nonvolatile memory to reform current commercial computing system. Inhibiting face-centered cubic (f-) to hexagonal (h-) phase transition of Ge 2 Sb 2 Te 5 (GST) thin film is essential for realizing high-density, high-speed, and low-power PCM. Although the ato...

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Veröffentlicht in:Scientific reports 2017-07, Vol.7 (1), p.1-8, Article 5915
Hauptverfasser: Zheng, Yonghui, Cheng, Yan, Huang, Rong, Qi, Ruijuan, Rao, Feng, Ding, Keyuan, Yin, Weijun, Song, Sannian, Liu, Weili, Song, Zhitang, Feng, Songlin
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Sprache:eng
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Zusammenfassung:Phase change memory (PCM) is a promising nonvolatile memory to reform current commercial computing system. Inhibiting face-centered cubic (f-) to hexagonal (h-) phase transition of Ge 2 Sb 2 Te 5 (GST) thin film is essential for realizing high-density, high-speed, and low-power PCM. Although the atomic configurations of f- and h-lattices of GST alloy and the transition mechanisms have been extensively studied, the real transition process should be more complex than previous explanations, e.g. vacancy-ordering model for f-to-h transition. In this study, dynamic crystallization procedure of GST thin film was directly characterized by in situ heating transmission electron microscopy. We reveal that the equilibrium to h-phase is more like an abnormal grain growth process driven by surface energy anisotropy. More specifically, [0001]-oriented h-grains with the lowest surface energy grow much faster by consuming surrounding small grains, no matter what the crystallographic reconfigurations would be on the frontier grain-growth boundaries. We argue the widely accepted vacancy-ordering mechanism may not be indispensable for the large-scale f-to-h grain growth procedure. The real-time observations in this work contribute to a more comprehensive understanding of the crystallization behavior of GST thin film and can be essential for guiding its optimization to achieve high-performance PCM applications.
ISSN:2045-2322
2045-2322
DOI:10.1038/s41598-017-06426-2