Development of Innovative Particleboard Panels

One aim of a joint European project called DIPP (Development of Innovative Particleboard (chipboard) Panels for a better mechanical performance and a lower environmental impact) is the development oflightweight particleboards made from annual/perennial farm plants such as hemp, sunflower, topinambur...

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Veröffentlicht in:Drvna industrija 2008-11, Vol.59 (3), p.131-136
Hauptverfasser: Francesco Balducci, Charles Harper, Peter Meinlschmidt, Brigitte Dix, Alfredo Sanasi
Format: Artikel
Sprache:eng
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Zusammenfassung:One aim of a joint European project called DIPP (Development of Innovative Particleboard (chipboard) Panels for a better mechanical performance and a lower environmental impact) is the development oflightweight particleboards made from annual/perennial farm plants such as hemp, sunflower, topinambur, maize and miscanthus. These lightweight particleboards are intended as a possible substitution for traditional wood-based particleboards used in the furniture industry. Therefore the requirements of the EN 312 concerning themoisture-related and mechanical properties of boards for interior use have to be met. The results of research have shown that the internal bond strength of one-layer lightweight particleboards made in the experiment meets the requirements of EN 312 (type P2) and the internal bond strength of three-layer boards with topinambur in the core layer does not meet these requirement. The lightweight boards failed to meet the requirements of modulus of elasticity and bending strength.
ISSN:0012-6772