Embedded Based Real-Time Monitoring in the High-Pressure Resin Transfer Molding Process for CFRP

Carbon Fiber Reinforced Plastics (CFRP) is a material developed for its high strength and light weight in a broad variety of industries including aerospace, automotive, and leisure. Due to the rapid molding cycle time, high-pressure resin transfer molding (HP-RTM) processes are prone to molding defects and susceptible to various process variables such as the resin injection rate, pressure and temperature in the mold, vacuum, end-gap, pressing force, and binder. In recent years, process monitoring technology with various sensors has been applied to stabilize the HP-RTM process and control process variables. The field-programmable gate array (FPGA) based embedded monitoring system proposed in this study enabled high-speed real-time signal processing with multiple sensors, namely pressure, temperature, and linear variable differential transformer (LVDT), and proved feasibility in the field. In the HP-RTM process, the impregnation and curing of the resin were predicted from the cavity pressure and temperature variations during the injection and curing stages. In addition, the thickness of the CFRP specimen was deduced from the change in the end-gap through the detection of the LVDT signal. Therefore, the causes of molding defects were analyzed through process monitoring and the influence of molding defects on the molding quality of CFRP was investigated.