Impact of Corn, Bean, and Semolina Flour Blends and Processing Methods on the Physical Properties and Antioxidant Activity of Instant Noodles
The main objective was to evaluate the use of common bean flour (CBF), corn flour, and semolina to obtain instant noodles by means of a hot dry and frying process. The hot drying process was conducted at 60 °C for 4 h, and frying was conducted at 140 °C and 160 °C for 1 and 3 min. Proximate analysis...
Gespeichert in:
Veröffentlicht in: | Physchem 2024-09, Vol.4 (3), p.356-368 |
---|---|
Hauptverfasser: | , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | The main objective was to evaluate the use of common bean flour (CBF), corn flour, and semolina to obtain instant noodles by means of a hot dry and frying process. The hot drying process was conducted at 60 °C for 4 h, and frying was conducted at 140 °C and 160 °C for 1 and 3 min. Proximate analysis, total phenolic content (TPC), the 2,2-diphenyl-1-picrylhydrazyl (DPPH) test, the oxygen radical absorbance capacity (ORAC) assay, phenolic acids and flavonoids profile by UPLC-ESI-MS/MS, the optimal cooking time (OCT), and color and texture analysis (TPA) were conducted. The general linear model and regression analysis were used. The incorporation of CBF resulted in an elevated protein content and TPC of the noodles. The noodles (hot dry) with CBF exhibited an enhanced antioxidant capacity. The adhesiveness has a direct correlation with the cinnamic, chlorogenic, and caffeic acid content (r2 = 0.95 or higher), as well as an inverse relationship with the vanillic, ferulic, and sinapic acids (r2 = −0.80 to −0.85). The dry hot noodles exhibited the lowest value of hardness (31.0 ± 1.5 N). The incorporation of common bean flour and corn flour enhances the nutritional profile of noodles. However, hot dry process affects their mechanical characteristics in comparison to the frying process. |
---|---|
ISSN: | 2673-7167 2673-7167 |
DOI: | 10.3390/physchem4030025 |