Elucidating the effects of surface wettability on boiling heat transfer using hydrophilic and hydrophobic surfaces with laser-etched microchannels
This study explores the nuanced interplay between surface wettability and morphology in nucleate boiling heat transfer. Surfaces with identical microstructures but varying wettability are created on copper substrates using laser texturing and a hydrophobic agent. The spacing between laser-etched mic...
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Veröffentlicht in: | Case studies in thermal engineering 2024-05, Vol.57, p.104357, Article 104357 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | This study explores the nuanced interplay between surface wettability and morphology in nucleate boiling heat transfer. Surfaces with identical microstructures but varying wettability are created on copper substrates using laser texturing and a hydrophobic agent. The spacing between laser-etched microchannels is adjusted to achieve different contact angles and percentages of laser-textured areas. Boiling performance is assessed with variations in channel spacing and surface coverage, revealing significant differences between hydrophilic and hydrophobic surfaces. The critical heat flux (CHF) enhancement mechanisms are identified, emphasizing either enhanced liquid replenishment or separate boiling and liquid-supply regions. A critical laser line spacing of 100 μm is determined, where hydrophobic and hydrophilic variants exhibit similar CHF. Interestingly, hydrophilic surfaces show a weak correlation between the heat transfer coefficient (HTC) and contact angle, while hydrophobic surfaces demonstrate a strong correlation. This separation of surface morphology and wettability confirms that lower wettability promotes early nucleate boiling and high HTC, whereas hydrophilic variants contribute to enhanced CHF with lower HTC. These distinctions are most prominent at high coverage with laser-textured areas and diminish as coverage decreases. The findings provide valuable insights into optimizing surface properties for efficient boiling heat transfer applications. |
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ISSN: | 2214-157X 2214-157X |
DOI: | 10.1016/j.csite.2024.104357 |