Optimizing the properties of vat photopolymerization 3D-printed SiC ceramics by multi-infiltration

ABSTRACTDigital Light Processing (DLP) technology is a highly effective molding method for creating complex structural parts. However, the low solid content of SiC stereolithography slurry has been found to diminish the mechanical properties of the ceramic, regardless of whether it is sintered by Re...

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Veröffentlicht in:Journal of Asian Ceramic Societies 2024-04, Vol.12 (2), p.164-171
Hauptverfasser: She, Yulong, Chang, Haotian, Tang, Jie, Guo, Xiaotian, Zhu, Yunzhou, Liu, Guiling, Yang, Xiao, Hu, Xiulan, Huang, Zhengren, Chen, Zhongming, Yang, Yong
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Sprache:eng
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Zusammenfassung:ABSTRACTDigital Light Processing (DLP) technology is a highly effective molding method for creating complex structural parts. However, the low solid content of SiC stereolithography slurry has been found to diminish the mechanical properties of the ceramic, regardless of whether it is sintered by Reactive Melt Infiltration (RMI) or Precursor Infiltration and Pyrolysis (PIP). This poses a significant challenge in improving the mechanical properties of SiC ceramics manufactured through DLP additive manufacturing. In response to this challenge, a novel method of RMI combined with infiltration is proposed in this study. The process involves the filling of the pores of the green body with pyrolytic carbon from PR or pyrolytic SiC from LHBPCS through circular infiltration, effectively increasing the content of SiC in the ceramics after reaction. Notably, the elastic modulus of RM-P2 and RM-L2 samples increased by 37.39% and 33.91%, respectively, demonstrating the potential of this method for preparing ceramics with high SiC content through stereolithography additive manufacturing. This innovative approach holds promise for overcoming the limitations previously associated with SiC ceramics produced through DLP additive manufacturing, opening up new possibilities for the development of high-performance SiC-based components.
ISSN:2187-0764
2187-0764
DOI:10.1080/21870764.2024.2330199