Development of Bead Modelling for Distortion Analysis Induced by Wire Arc Additive Manufacturing using FEM and Experiment

In this research, Wire Arc Additive Manufacturing is modelled and simulated to determine the most suitable bead modelling strategy. This analysis is aimed to predict distortion by means of thermomechanical Finite Element Method (FEM). The product model with wire as feedstock on plate as substrate an...

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Veröffentlicht in:MATEC web of conferences 2019, Vol.269, p.5003
Hauptverfasser: Prajadhiama, Keval P, Manurung, Yupiter HP, Minggu, Zaidi, Pengadau, Fetisia HS, Graf, Marcel, Haelsig, Andre, Adams, Tom-Eric, Choo, Hui Leng
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Sprache:eng
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Zusammenfassung:In this research, Wire Arc Additive Manufacturing is modelled and simulated to determine the most suitable bead modelling strategy. This analysis is aimed to predict distortion by means of thermomechanical Finite Element Method (FEM). The product model with wire as feedstock on plate as substrate and process simulation are designed in form of multi-layered beads and single string using MSC Marc/Mentat. This research begins with finding suitable WAAM parameters which takes into account the bead quality. This is done by using robotic welding system with 01.2mm filler wire (AWS A5.28 : ER80SNi1), shielding gas (80% Ar/ 20% CO 2 ) and 6mm-thick low carbon steel as base plate. Further, modelling as well as simulation are to be conducted with regards to bead spreading of each layers. Two different geometrical modelling regarding the weld bead are modelled which are arc and rectangular shape. Equivalent material properties from database and previous researches are implemented into simulation to ensure a realistic resemblance. It is shown that bead modelling with rectangular shape exhibits faster computational time with less error percentage on distortion result compared to arc shape. Moreover, by using the rectangular shape, the element and meshing are much easier to be designed rather than arc shape bead.
ISSN:2261-236X
2274-7214
2261-236X
DOI:10.1051/matecconf/201926905003