Effect of Pulse Current on Interface Microstructure and Bonding Properties of TA1/304 Double-Layer Clad plates

It is difficult to effectively improve the low bonding strength of TA1/304 clad plates. This study proposes a new process for applying pulse current (1500 A, 500 Hz, 50% duty cycle) to TA1/304 clad plates during the rolling process, which changes the interface microstructure and effectively improves the bonding strength of the clad plates. The influence of the pulsed current on the interface microstructure and bonding strength was systematically studied. The results indicate that the clad plate is initially bonded at 750 °C and 35% reduction ratio under electrically-assisted rolling (EAR), and finally the higher bonding strength is obtained at 850 °C and 48% reduction ratio, reaching 395 MPa. The strengthening of the interface element diffusion and grain refinement under the action of the pulsed current are important reasons for the improvement in the bonding strength of the clad plate. This discovery provides new ideas for the preparation of clad plates with high bonding performance.