Design and performance evaluation of thin-film actuators based on flexible Ni-Co substrates

This paper proposes a new design of bimorph-type electrothermal actuators based on flexible Ni-Co substrates and describes the results of the finite element method (FEM) simulation and performance evaluation of the actuators. In the design of the actuators, a multilayer structure consisting of an adhesion layer, two insulation layers, and a Pt (platinum) heater layer was formed on the Ni-Co flexible substrate that was patterned in an individual shape. The thin-film actuators proposed in this study could be detached from a Si carrier wafer and adhered to other micro or macrostructural elements. To investigate the temperature distribution and mechanical behavior of the actuators, multiphysics FEM simulations combining electrothermal and static structural analyses were carried out. The actuators were fabricated using conventional microfabrication and electroplating technologies on Si carrier wafer; then, the actuators were peeled off from the carrier wafer using the release process proposed in this paper. After fabricating the actuators, the deflection of their tips was evaluated and compared with that obtained from the FEM simulations.