Telemetric angle and position sensing using millimeter-wave metamaterial and a frequency-modulated continuous-wave (FMCW) chip

We present a fully telemetric sensor concept for angle and position measurement. It is based on single-layer millimeter-wave metamaterials that exhibit an anisotropic resonant behavior in interaction with incident electromagnetic waves. The angle of rotation is determined from the reflected millimet...

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Veröffentlicht in:Journal of sensors and sensor systems 2024-03, Vol.13 (1), p.31-39
Hauptverfasser: Schossmann, Alexander, Töfferl, Michael, Schmidt, Christoph, Bergmann, Alexander
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Sprache:eng
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Zusammenfassung:We present a fully telemetric sensor concept for angle and position measurement. It is based on single-layer millimeter-wave metamaterials that exhibit an anisotropic resonant behavior in interaction with incident electromagnetic waves. The angle of rotation is determined from the reflected millimeter waves of the metamaterial target using a millimeter wave chip transceiver. We use a metamaterial geometry exhibiting anisotropic Fano-type resonant behavior. The Fano-type resonance shows a distinct minimum in the reflection spectrum, even with a single layer of metamaterial. The metamaterial target is manufactured on a printed circuit board (PCB) laminate with low-cost standard manufacturing methods. We present an analytical model estimating the resonance frequency of the metamaterial used. The model allows us to assess whether with the Fano-type metamaterial unit cell structure resonance frequencies in the millimeter wave regime are achievable and compliant with standard PCB manufacturing design rules. We performed proof-of-principle experiments with the metamaterial targets and a vector network analyzer, assisted by a detailed analysis of the sensor effect by means of finite-element method calculations. Finally, we implemented a demonstrator setup containing a state-of-the-art frequency-modulated continuous-wave (FMCW) radar chip and a metamaterial target manufactured with standard PCB manufacturing processes.
ISSN:2194-878X
2194-8771
2194-878X
DOI:10.5194/jsss-13-31-2024