Thermal expansion, electrical conductivity and hardness of Mn3Zn0.5Sn0.5N/Al composites

Mn Zn Sn N/Al composites were successfully prepared by sintering at 623 K and 723 K. It is found that the thermal expansion of Al is effectively decreased with the addition of negative thermal expansion material Mn Zn Sn N, which plays the role of the thermal expansion compensator in the composite system. The thermal expansion of composites can be tailored by adjusting the volume fraction of Mn Zn Sn N. In particular, 40 vol.%-Mn Zn Sn N/Al composite sintered at 723 K has a low thermal expansion coefficient of 2.38×10 K . The thermal expansion of Mn Zn Sn N/Al composites matches well with those calculated from the rule of mixture (ROM) estimation. The ROM model can be used to predict the thermal expansion of Mn Zn Sn N/Al composite and design Mn Zn Sn N/Al composite with a particular thermal expansion. Mn Zn Sn N/Al composites exhibit excellent electrical conductivities at the level of 10 S/cm. The hardness of the as-prepared composites increases by adding Mn Zn Sn N in Al.