Study on Relationships between Curing Pressures and Mechanical Properties for Epoxy Adhesive Films

In this paper, the effects of different curing pressures on the mechanical properties of epoxy adhesive films were investigated. When the curing pressure increases from 0 MPa to 0.5 MPa, Nano-indentation analysis shows that the elastic modulus of the cured adhesive films increases from 2.92 GPa to 3.49 GPa, the tensile strength increases from 42.0 MPa to 43.7 MPa, and the breaking elongation increases from 2.61 % to 3.73 %. It was indicated that the microscopic and macroscopic mechanical properties of the cured adhesive films were improved. DMA results showed that, as the curing pressure increases, the Tg of the cured product does not change significantly, but the crosslinking density is significantly improved. These results indicate that a higher modulus of the cured product could be gained by increasing the curing pressure appropriately.