An Analytical Method for Modelling Pull-In Effect during Anodic Bonding

Pull-in effect is a common phenomenon during anodic bonding, a key step in the fabrication processes of capacitive sensors and actuators. To assist the designs and fabrications of these transducers, this paper presents an analytical method for modelling the pull-in effect during anodic bonding. The pull-in effect model was verified by finite element analysis and a verification experiment respectively. The verification results indicate that the analytical method for modelling the pull-in effect during anodic bonding is capable for predicting pull-in voltages of anodically bonded capacitive sensors and actuators in a universal and practical manner without any additional fabrication process.