Sub-terahertz silicon-based on-chip absorption spectroscopy using thin-film model for biological applications
Spectroscopy in the sub-terahertz (sub-THz) range of frequencies has been utilized to study the picosecond dynamics and interaction of biomolecules. However, widely used free-space THz spectrometers are typically limited in their functionality due to low signal-to-noise ratio and complex setup. On-c...
Gespeichert in:
Veröffentlicht in: | Scientific reports 2022-10, Vol.12 (1), p.17747-17747, Article 17747 |
---|---|
Hauptverfasser: | , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | Spectroscopy in the sub-terahertz (sub-THz) range of frequencies has been utilized to study the picosecond dynamics and interaction of biomolecules. However, widely used free-space THz spectrometers are typically limited in their functionality due to low signal-to-noise ratio and complex setup. On-chip spectrometers can revolutionize THz spectroscopy allowing integration, compactness, and low-cost fabrication. In this paper, a low-loss silicon-based platform is proposed for on-chip sub-THz spectroscopy. Through functionalization of silicon chip and immobilization of bio-particles, we demonstrate the ability to characterize low-loss nano-scale biomolecules across the G-band (0.14–0.22 THz). We also introduce an electromagnetic thin-film model to account for the loading effect of the immobilized biomolecules, i.e. dehydrated streptavidin and immunoglobulin antibody, as two key molecules in the biosensing discipline. The proposed platform was fabricated using a single mask micro-fabrication process, and then measured by a vector network analyzer (VNA), which offers high dynamic range and high spectral resolution measurements. The proposed planar platform is general and paves the way towards low-loss, cost-effective and integrated sub-THz biosensors for the detection and characterization of biomolecules. |
---|---|
ISSN: | 2045-2322 2045-2322 |
DOI: | 10.1038/s41598-022-21015-8 |