Experimental study of high-performance cooling system pipeline diameter and working fluid amount

This work deals with heat transfer resulting from the operation of power electronic components. Heat is removed from the mounting plate, which is the evaporator of the loop thermosyphon to the condenser and by natural convection is transferred to ambient. This work includes proposal of cooling device - loop thermosyphon, with its construct and follow optimization of cooling effect. Optimization proceeds by selecting the quantity of working fluid and selection of diameters vapour line and liquid line of loop thermosyphon.