Terahertz Metamaterials for Free-Space and on-Chip Applications: From Active Metadevices to Topological Photonic Crystals

Terahertz (THz) waves have exhibited promising applications in imaging, sensing, and communications, especially for the next-generation wireless communications due to the large bandwidth and abundant spectral resources. Modulators and waveguides to manipulate THz waves are becoming key components to...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Advanced devices & instrumentation 2022-01, Vol.2022
Hauptverfasser: Xing, Hongyang, Fan, Junxing, Lu, Dan, Gao, Zhen, Shum, Perry Ping, Cong, Longqing
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Terahertz (THz) waves have exhibited promising applications in imaging, sensing, and communications, especially for the next-generation wireless communications due to the large bandwidth and abundant spectral resources. Modulators and waveguides to manipulate THz waves are becoming key components to develop the relevant technologies where metamaterials have exhibited extraordinary performance to control free-space and on-chip propagation, respectively. In this review, we will give a brief overview of the current progress in active metadevices and topological photonic crystals, for applications of terahertz free-space modulators and on-chip waveguides. In the first part, the most recent research progress of active terahertz metadevices will be discussed by combining metamaterials with various active media. In the second part, fundamentals of photonic topological insulations will be introduced where the topological photonic crystals are an emerging research area that would boost the development of on-chip terahertz communications. It is envisioned that the combination of them would find great potential in more advanced terahertz applications, such as reconfigurable topological waveguides and topologically-protected metadevices.
ISSN:2767-9713
2767-9713
DOI:10.34133/2022/9852503