MODELING OF A TEMPERATURE FIELD OF THE ELECTRONIC BLOCK WITH THERMOELECTRIC COOLING AS A PART OF A CASE FOR THE TELECOMMUNICATION EQUIPMENT

In the article the mathematical model of the electronic module with thermoelectric cooling in the composition of the enclosure for telecommunications equipment. Description of processes of heat exchange in the electronic unit, subject to the assumptions contained in the parallelepiped with volumetric sources and sinks of heat, the analysis of the temperature field is reduced to solving the system of equations of heat conductivity of a parallelepiped taking into account the bulk convection and heat transfer of the cooling flow with a parallelepiped.