Effect of crystallinity and thickness on thermal transport in layered PtSe2

We present a comparative investigation of the influence of crystallinity and film thickness on the acoustic and thermal properties of layered PtSe 2 films of varying thickness (1–40 layers) using frequency-domain thermo-reflectance, low-frequency Raman, and pump-probe coherent phonon spectroscopy. W...

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Veröffentlicht in:NPJ 2D materials and applications 2022-05, Vol.6 (1), p.1-9, Article 32
Hauptverfasser: El Sachat, Alexandros, Xiao, Peng, Donadio, Davide, Bonell, Frédéric, Sledzinska, Marianna, Marty, Alain, Vergnaud, Céline, Boukari, Hervé, Jamet, Matthieu, Arregui, Guillermo, Chen, Zekun, Alzina, Francesc, Sotomayor Torres, Clivia M., Chavez-Angel, Emigdio
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Sprache:eng
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Zusammenfassung:We present a comparative investigation of the influence of crystallinity and film thickness on the acoustic and thermal properties of layered PtSe 2 films of varying thickness (1–40 layers) using frequency-domain thermo-reflectance, low-frequency Raman, and pump-probe coherent phonon spectroscopy. We find ballistic cross-plane heat transport up to ~30 layers PtSe 2 and a 35% reduction in the cross-plane thermal conductivity of polycrystalline films with thickness larger than 20 layers compared to the crystalline films of the same thickness. First-principles calculations further reveal a high degree of thermal conductivity anisotropy and a remarkable large contribution of the optical phonons to the thermal conductivity in bulk (~20%) and thin PtSe 2 films (~30%). Moreover, we show strong interlayer interactions in PtSe 2 , short acoustic phonon lifetimes in the range of picoseconds, an out-of-plane elastic constant of 31.8 GPa, and a layer-dependent group velocity ranging from 1340 ms −1 in bilayer to 1873 ms −1 in eight layers of PtSe 2 . The potential of tuning the lattice thermal conductivity of layered materials with the level of crystallinity and the real-time observation of coherent phonon dynamics open a new playground for research in 2D thermoelectric devices and provides guidelines for thermal management in 2D electronics.
ISSN:2397-7132
2397-7132
DOI:10.1038/s41699-022-00311-x