Adhesion Strength Change Analysis Based on the Application Surface Area Ratio of Spot-Bonded Tiles on Vertical Walls of High Humidity Facilities

Facility walls with high relative humidity, such as bathrooms or kitchens installed with tiles by spot-bonding methods, become far more prone to defect or adhesion failure when using large or heavy tiles and insufficient application area of adhesive but is still continued to be practiced due to thei...

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Veröffentlicht in:Applied sciences 2021-06, Vol.11 (12), p.5357
Hauptverfasser: Lee, Jung-hun, Kim, Bum-soo, Oh, Kyu-hwan, Jiang, Bo, He, Xingyang, Kim, Byoung-il, Oh, Sang-keun
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Sprache:eng
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Zusammenfassung:Facility walls with high relative humidity, such as bathrooms or kitchens installed with tiles by spot-bonding methods, become far more prone to defect or adhesion failure when using large or heavy tiles and insufficient application area of adhesive but is still continued to be practiced due to their low costs in the material. Most importantly, if this practice is to be continued, the changes in adhesion strength of the tiles based on different adhesive application areas of adhesives must be clarified such that the very least secure application can be achieved even by using spot-bonding methods. In this regard, an experiment was conducted in this study where tile-adhered specimens with different adhesive-applied area ratios (AR) of 60 ± 2%, 80 ± 2%, and 100% were prepared. Tile adhesion strength was subsequently measured, after sectioning the entire surface of the tile into 40 pieces. Experimental results showed that the adhesion strength above the standard criteria could be achieved for about 75% of the entire tile with AR 100% conditioning, followed by 30% of the entire tile with AR 80 ± 2% conditioning, and 20% of the entire tile for AR 60 ± 2% conditioning. Further analysis showed that with AR 80 ± 2% and AR 60 ± 2% conditions, the overall adhesion strength decreased by the range of about 59–67% compared to the AR 100% application conditions. The results of the study intended to provide an analytical basis of guidelines and risks with the potential usage of spot-bonding and should only be used if AR 100% application is planned.
ISSN:2076-3417
2076-3417
DOI:10.3390/app11125357