Extensive 3D mapping of dislocation structures in bulk aluminum

Thermomechanical processing such as annealing is one of the main methods to tailor the mechanical properties of materials, however, much is unknown about the reorganization of dislocation structures deep inside macroscopic crystals that give rise to those changes. Here, we demonstrate the self-organ...

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Veröffentlicht in:Scientific reports 2023-03, Vol.13 (1), p.3834-11, Article 3834
Hauptverfasser: Yildirim, Can, Poulsen, Henning F., Winther, Grethe, Detlefs, Carsten, Huang, Pin H., Dresselhaus-Marais, Leora E.
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Sprache:eng
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Zusammenfassung:Thermomechanical processing such as annealing is one of the main methods to tailor the mechanical properties of materials, however, much is unknown about the reorganization of dislocation structures deep inside macroscopic crystals that give rise to those changes. Here, we demonstrate the self-organization of dislocation structures upon high-temperature annealing in a mm-sized single crystal of aluminum. We map a large embedded 3D volume ( 100 × 300 × 300 μ m 3 ) of dislocation structures using dark field X-ray microscopy (DFXM), a diffraction-based imaging technique. Over the wide field of view, DFXM’s high angular resolution allows us to identify subgrains, separated by dislocation boundaries, which we identify and characterize down to the single-dislocation level using computer-vision methods. We demonstrate how even after long annealing times at high temperatures, the remaining low density of dislocations still pack into well-defined, straight dislocation boundaries (DBs) that lie on specific crystallographic planes. In contrast to conventional grain growth models, our results show that the dihedral angles at the triple junctions are not the predicted 120 ∘ , suggesting additional complexities in the boundary stabilization mechanisms. Mapping the local misorientation and lattice strain around these boundaries shows that the observed strain is shear, imparting an average misorientation around the DB of ≈ 0.003 to 0.006 ∘ .
ISSN:2045-2322
2045-2322
DOI:10.1038/s41598-023-30767-w