Innovative filler strategies for high-performance LSR in electrical and industrial applications: A review

•Incorporating Al₂O₃, cordierite, and ATH improves the tensile strength, tear resistance, and hardness of LSR composites.•LSR with carbon black filler demonstrates 950 % elongation at break, showcasing exceptional flexibility.•Nano SiO₂ elevates the decomposition temperature to 1000 °C, ensuring excellent thermal stability.•Thermal conductivity is enhanced by fillers, with silica-filled LSR achieving 0.79 W/mK, ideal for insulation.•Nanofillers enable precise density adjustments in LSR, from 1.1 g/cc (5 % cordierite) to 1.24 g/cc (30 % P–LiMn₂O₄). This research presents a novel strategy for improving the electrical insulation properties of Liquid Silicone Rubber (LSR) through the strategic use of advanced fillers such as graphene nanoplates, Carbon black, Graphene oxide, alumina (Al₂O₃), epoxy resin, etc. In the study these materials are combined in a novel approach, leading to significant improvements in dielectric strength Increase to LSR/1 wt/Cordierite, tensile strength rising by nearly 98, reaching 10.3 MPa when using DBPMH filler. Alumina contributes to a notable increase in tear strength, achieving 25.3 N/mm with 10 wt% inclusion, while Shore A hardness dramatically improves, reaching 70 with vinyl ester and thermal stability, The addition of graphene nanoplates and nano SiO₂, even in low concentrations, significantly enhances the tensile modulus and elongation at break of LSR, challenging the belief that higher filler content is necessary. The SR/8wt% Carbon black composite exhibits a 700 % increase in elongation at break, reflecting greater flexibility, while alumina raises the tensile modulus to 1.3 MPa, enhancing stiffness. Recent findings indicate that Al₂O₃-filled liquid silicone rubber (LSR) composites maintain stable pH levels across various chemical environments. X-ray diffraction (XRD) analysis shows improved crystalline structures that enhance material stability, paving the way for high-performance materials in industrial and electronic applications.