DESIGN OF THE TEMPERATURE SENSOR BY SIMULATION MODELING

Background. The role and scope of temperature measurements in modern technology is extremely significant, and therefore the diversity of the problems of temperature measurements themselves is very large. Temperature measurements are the basis for studying the energy and strength characteristics of u...

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Veröffentlicht in:Надежность и качество сложных систем 2023-10 (3)
Hauptverfasser: Ponomarev, V.N., Trofimov, A.A., Deryabin, D.V., Fokina, E.A., Maksov, A.A.
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Sprache:eng
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Zusammenfassung:Background. The role and scope of temperature measurements in modern technology is extremely significant, and therefore the diversity of the problems of temperature measurements themselves is very large. Temperature measurements are the basis for studying the energy and strength characteristics of units and systems, optimizing their efficiency and reliability. Rocket and space technology is one of the most capacious areas of technology, characterized by an exceptional variety of problems of temperature measurements. It organically includes most of the problems of temperature measurements solved in aviation technology, general industrial technology and power engineering, surface and underwater shipbuilding, and other areas of technology. Therefore, the issue of increasing the reliability requirements for products of rocket and space technology and their components under conditions of harsh operation and external influences is of particular relevance. Materials and methods. Simulation modeling was used as a research method, in which its model, with which experiments are carried out in order to obtain information about this object, replaces the studied sensor. In the experiment, specialized software Solidworks was used, which avoids expensive and lengthy test cycles. Results. As a result of the simulation, diagrams of the temperature distribution fields at critical temperatures were obtained in order to study the influence of these conditions on the parts included in the object under study.
ISSN:2307-4205
DOI:10.21685/2307-4205-2023-3-7