Development of a desiccant based dielectric for monitoring humidity conditions in miniaturized hermetic implantable packages

Lifetime estimation of implanted electronics in hermetic packages requires the prediction of the humidity induced lifetime. Classical approaches are limited in applications where miniaturized packages and a buffered humidity at low values are being utilized. An approach to overcome these limitations is described and investigations on suitable materials and measurement setups are presented. The findings support the usability of a Zeolite-silicone based desiccant system as a dielectric for a new type of online sensor. The future exploitation of this new sensing principle can allow the monitoring and prediction of humidity conditions inside of highly reliable miniaturized hermetic implantable packages.