Multiphysics design and fabrication of 3D electroplated VIA materials topographies for next generation energy and sensor technologies

[Display omitted] •Novel 3D multiphysics simulations were used to model electroplated Cu vertical interconnect access (VIA) topographies.•The simulation results revealed that diffusion-controlled mass transport conditions can enable flat, concave and convex Cu VIA topography design options.•The simulations were validated by a comparative study with fabricated Cu VIA arrays showing a highly positive correlation.•Flat and concave topographies were achieved at Cu VIA to VIA mold thickness ratios of ≤0.5 and ≥0.8, respectively.•Tailored convex topographies enabled by altering the dual layer VIA mold system layer 2/layer 1 width/diameter ratio at values