Design of a 108 Pin VLSI Package With Low Thermal Resistance

The design of a 108 pin VLSI package is described. The package has low thermal resistance and can, therefore, dissipate 4 watts of power. The package design is now being used commercially in high‐end computers made by Hitachi.

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Veröffentlicht in:Active and passive electronic components 1983-01, Vol.10 (4), p.311-316
Hauptverfasser: Otsuka, Kanji, Usami, Tamotsu
Format: Artikel
Sprache:eng
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Zusammenfassung:The design of a 108 pin VLSI package is described. The package has low thermal resistance and can, therefore, dissipate 4 watts of power. The package design is now being used commercially in high‐end computers made by Hitachi.
ISSN:0882-7516
1563-5031
DOI:10.1155/APEC.10.311