Marangoni-driven deterministic formation of softer, hollow microstructures for sensitivity-enhanced tactile system
Microengineering the dielectric layers with three-dimensional microstructures has proven effective in enhancing the sensitivity of flexible pressure sensors. However, the widely employed geometrical designs of solid microstructures exhibit limited sensitivity over a wide range of pressures due to th...
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Veröffentlicht in: | Nature communications 2024-07, Vol.15 (1), p.5596-13, Article 5596 |
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Zusammenfassung: | Microengineering the dielectric layers with three-dimensional microstructures has proven effective in enhancing the sensitivity of flexible pressure sensors. However, the widely employed geometrical designs of solid microstructures exhibit limited sensitivity over a wide range of pressures due to their inherent but undesired structural compressibility. Here, a Marangoni-driven deterministic formation approach is proposed for fabricating hollow microstructures, allowing for greater deformation while retarding structural stiffening during compression. Fluid convective deposition enables solute particles to reassemble in template microstructures, controlling the interior cavity with a void ratio exceeding 90%. The hollow micro-pyramid sensor exhibits a 10-fold sensitivity improvement across wider pressure ranges over the pressure sensor utilizing solid micro-pyramids, and an ultra-low detect limit of 0.21 Pa. With the advantages of facilitation, scalability, and large-area compatibility, such an approach for hollow microstructures can be expanded to other sensor types for superior performance and has considerable potential in robotic tactile and epidermal devices.
Many solid microstructures have limited sensitivity over a wide pressure range due to their inherent structural compressibility. Xiong et al. propose a Marangoni-driven deterministic formation approach for creating hollow microstructures, enabling greater deformation while hindering structural stiffening. |
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ISSN: | 2041-1723 2041-1723 |
DOI: | 10.1038/s41467-024-49864-z |