Effect of Vertical High Magnetic Field on the Morphology of Solid-Liquid Interface during the Directional Solidification of Zn-2wt.%Bi Immiscible Alloy

The morphology of the solid-liquid (S-L) interface is crucial for the directionally solidified microstructures of various alloys. This paper investigates the effect of vertical high magnetic field (VHMF) on the morphology evolution of the S-L interface and the solidified microstructure during the di...

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Veröffentlicht in:Metals (Basel ) 2022-05, Vol.12 (5), p.875
Hauptverfasser: Zhou, Bangfei, Guo, Xianghui, Lin, Wenhao, Liu, Ying, Guo, Yifeng, Zheng, Tianxiang, Zhong, Yunbo, Wang, Hui, Wang, Qiuliang
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Sprache:eng
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Zusammenfassung:The morphology of the solid-liquid (S-L) interface is crucial for the directionally solidified microstructures of various alloys. This paper investigates the effect of vertical high magnetic field (VHMF) on the morphology evolution of the S-L interface and the solidified microstructure during the directional solidification of Zn-2wt.%Bi immiscible alloy. The results indicate that the morphology of the S-L interface is highly dependent on the VHMF, resulting in various solidified microstructures. When the growth rate was 1 μm/s, the aligned droplets were formed directly at the disturbed S-L interface under a 1 T VHMF. However, the stability of the S-L interface was improved to form a stable Bi-rich fiber under a 5 T VHMF. When the growth rate was 5 μm/s, the S-L interface was changed from cellular to dendritic to cellular again with increasing magnetic flux density. A theory regarding constitutional supercooling and efficient solute diffusion has been proposed to explain the S-L interface transition under the VHMF. The difference in the effective diffusion capacity of the solute originates from the thermoelectric magnetic effect and the magneto-hydrodynamic damping effect. The present work may initiate a new method to transform the solidified microstructures of immiscible alloys via an applied magnetic field during directional solidification.
ISSN:2075-4701
2075-4701
DOI:10.3390/met12050875