GeSnOI mid-infrared laser technology

GeSn alloys are promising materials for CMOS-compatible mid-infrared lasers manufacturing. Indeed, Sn alloying and tensile strain can transform them into direct bandgap semiconductors. This growing laser technology however suffers from a number of limitations, such as poor optical confinement, lack...

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Veröffentlicht in:Light, science & applications science & applications, 2021-11, Vol.10 (1), p.232-232, Article 232
Hauptverfasser: Wang, Binbin, Sakat, Emilie, Herth, Etienne, Gromovyi, Maksym, Bjelajac, Andjelika, Chaste, Julien, Patriarche, Gilles, Boucaud, Philippe, Boeuf, Frédéric, Pauc, Nicolas, Calvo, Vincent, Chrétien, Jérémie, Frauenrath, Marvin, Chelnokov, Alexei, Reboud, Vincent, Hartmann, Jean-Michel, El Kurdi, Moustafa
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Sprache:eng
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Zusammenfassung:GeSn alloys are promising materials for CMOS-compatible mid-infrared lasers manufacturing. Indeed, Sn alloying and tensile strain can transform them into direct bandgap semiconductors. This growing laser technology however suffers from a number of limitations, such as poor optical confinement, lack of strain, thermal, and defects management, all of which are poorly discussed in the literature. Herein, a specific GeSn-on-insulator (GeSnOI) stack using stressor layers as dielectric optical claddings is demonstrated to be suitable for a monolithically integration of planar Group-IV semiconductor lasers on a versatile photonic platform for the near- and mid-infrared spectral range. Microdisk-shape resonators on mesa structures were fabricated from GeSnOI, after bonding a Ge 0.9 Sn 0.1 alloy layer grown on a Ge strain-relaxed-buffer, itself on a Si(001) substrate. The GeSnOI microdisk mesas exhibited significantly improved optical gain as compared to that of conventional suspended microdisk resonators formed from the as-grown layer. We further show enhanced vertical out-coupling of the disk whispering gallery mode in-plane radiation, with up to 30% vertical out-coupling efficiency. As a result, the GeSnOI approach can be a valuable asset in the development of silicon-based mid-infrared photonics that combine integrated sources in a photonic platform with complex lightwave engineering.
ISSN:2047-7538
2095-5545
2047-7538
DOI:10.1038/s41377-021-00675-7