Universal hydrogel adhesives with robust chain entanglement for bridging soft electronic materials

Ensuring stable integration of diverse soft electronic components for reliable operation under dynamic conditions is crucial. However, integrating soft electronics, comprising various materials like polymers, metals, and hydrogels, poses challenges due to their different mechanical and chemical properties. This study introduces a dried-hydrogel adhesive made of poly(vinyl alcohol) and tannic acid multilayers (d-HAPT), which integrates soft electronic materials through moisture-derived chain entanglement. d-HAPT is a thin (~1 µm) and highly transparent (over 85% transmittance in the visible light region) adhesive, showing robust bonding (up to 3.6 MPa) within a short time (