Thermal stress analysis for a cusp-type crack problem under remote thermal loading

In this paper, the thermal stress analysis for a cusp-type crack problem under remote thermal loading is carried out. The remote thermal loading is applied at infinite place. Along the cusp-type crack, two kinds of thermal condition are assumed: (a) the thermal insulated condition, and (b) vanishing temperature condition. The thermal temperature and the stress fields are evaluated by using the complex mapping technique and the complex potentials. It is found that the obtained stress intensity factors (SIF) are quite different for the two mentioned boundary conditions.