Enhanced attractive force via torsion spring as rotatable tip structure in beam-structure electrostatic chucks

•Beam-structure electrostatic chuck is potential semiconductor handling technology.•System energy analysis identifies three critical points during handling operations.•Highest attractive force matches with moment of tip-target breaking full contact.•Increasing tip rotatability will enhance attractive force generation on flat target.•Torsion spring ensures efficient and reliable repeating manipulating operations. This research aims to replace ball joints of beam-structure electrostatic chucks (BSESC), which are limited by issues such as structural friction and inconsistent operation, thus enhancing the applicability in industrial settings. Torsion springs are used as rotational degree-of-freedom (RDOF) mechanisms at the tip of BSESCs to reduce friction and improve repeatability, while also highlighting the positive relationship between tip rotatability and the attractive force generated. Following the law of conservation of energy, an analytical calculation was performed using a beam-spring-capacitor model to establish the correlation between tip rotatability and the maximum attractive force generated through energy system analysis. An analytical solution was derived, explicitly defining the relationship between tip rotatability and the achievable attractive force. The results were plotted using MATLAB. Experimental validations were carried out by fabricating devices that differed only in tip rotatability, and measurements of the attractive force were taken. Both analytical and experimental results clearly demonstrate a positive relationship between tip rotatability and attractive force generation in BSESCs. The use of torsion springs effectively reduces the energy concentration at the tip, delaying detachment while simultaneously increasing the attractive force, significantly improving the overall performance of BSESCs. These findings provide a foundation for future industrial applications, particularly for automated large-area manipulation of irregularly shaped targets in industries such as screen production and semiconductors.