New copper carboxylate pyrene dimers: synthesis, crystal structure, Hirshfeld surface analysis and electrochemical characterization
Two new copper dimers, namely, bis(dimethyl sulfoxide)tetrakis(μ-pyrene-1-carboxylato)dicopper( Cu — Cu ), [Cu 2 (C 17 H 9 O 2 ) 4 (C 2 H 6 OS) 2 ] or [Cu 2 (pyr-COO − ) 4 (DMSO) 2 ] ( 1 ), and bis(dimethylformamide)tetrakis(μ-pyrene-1-carboxylato)dicopper( Cu — Cu ), [Cu 2 (C 17 H 9 O 2 ) 4 (C 3 H...
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Veröffentlicht in: | Acta crystallographica. Section E, Crystallographic communications Crystallographic communications, 2024-01, Vol.80 (1), p.1-9 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Two new copper dimers, namely, bis(dimethyl sulfoxide)tetrakis(μ-pyrene-1-carboxylato)dicopper(
Cu
—
Cu
), [Cu
2
(C
17
H
9
O
2
)
4
(C
2
H
6
OS)
2
] or [Cu
2
(pyr-COO
−
)
4
(DMSO)
2
] (
1
), and bis(dimethylformamide)tetrakis(μ-pyrene-1-carboxylato)dicopper(
Cu
—
Cu
), [Cu
2
(C
17
H
9
O
2
)
4
(C
3
H
7
NO)
2
] or [Cu
2
(pyr-COO
−
)
4
(DMF)
2
] (
2
) (pyr = pyrene), were synthesized from the reaction of pyrene-1-carboxylic acid, copper(II) nitrate and triethylamine from solvents DMSO and DMF, respectively. While
1
crystallized in the space group
P
\overline{1}, the crystal structure of
2
is in space group
P
2
1
/
n
. The Cu atoms have octahedral geometries, with four oxygen atoms from carboxylate pyrene ligands occupying the equatorial positions, a solvent molecule coordinating at one of the axial positions, and a Cu...Cu contact in the opposite position. The packing in the crystal structures exhibits π–π stacking interactions and short contacts through the solvent molecules. The Hirshfeld surfaces and two-dimensional fingerprint plots were generated for both compounds to better understand the intermolecular interactions and the contribution of heteroatoms from the solvent ligands to the crystal packing. In addition, a Cu
2+
/Cu
1+
quasi-reversible redox process was identified for compound
2
using cyclic voltammetry that accounts for a diffusion-controlled electron-donation process to the Cu dimer. |
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ISSN: | 2056-9890 2056-9890 |
DOI: | 10.1107/S2056989023010277 |