Gate Tunable Transport in Graphene/MoS₂/(Cr/Au) Vertical Field-Effect Transistors

Two-dimensional materials based vertical field-effect transistors have been widely studied due to their useful applications in industry. In the present study, we fabricate graphene/MoS₂/(Cr/Au) vertical transistor based on the mechanical exfoliation and dry transfer method. Since the bottom electrod...

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Veröffentlicht in:Nanomaterials (Basel, Switzerland) Switzerland), 2017-12, Vol.8 (1), p.14
Hauptverfasser: Nazir, Ghazanfar, Khan, Muhammad Farooq, Aftab, Sikandar, Afzal, Amir Muhammad, Dastgeer, Ghulam, Rehman, Malik Abdul, Seo, Yongho, Eom, Jonghwa
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Sprache:eng
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Zusammenfassung:Two-dimensional materials based vertical field-effect transistors have been widely studied due to their useful applications in industry. In the present study, we fabricate graphene/MoS₂/(Cr/Au) vertical transistor based on the mechanical exfoliation and dry transfer method. Since the bottom electrode was made of monolayer graphene (Gr), the electrical transport in our Gr/MoS₂/(Cr/Au) vertical transistors can be significantly modified by using back-gate voltage. Schottky barrier height at the interface between Gr and MoS₂ can be modified by back-gate voltage and the current bias. Vertical resistance (R ) of a Gr/MoS₂/(Cr/Au) transistor is compared with planar resistance (R ) of a conventional lateral MoS₂ field-effect transistor. We have also studied electrical properties for various thicknesses of MoS₂ channels in both vertical and lateral transistors. As the thickness of MoS₂ increases, R increases, but R decreases. The increase of R in the thicker MoS₂ film is attributed to the interlayer resistance in the vertical direction. However, R shows a lower value for a thicker MoS₂ film because of an excess of charge carriers available in upper layers connected directly to source/drain contacts that limits the conduction through layers closed to source/drain electrodes. Hence, interlayer resistance associated with these layers contributes to planer resistance in contrast to vertical devices in which all layers contribute interlayer resistance.
ISSN:2079-4991
2079-4991
DOI:10.3390/nano8010014