MXene Contact Engineering for Printed Electronics

MXenes emerging as an amazing class of 2D layered materials, have drawn great attention in the past decade. Recent progress suggest that MXene‐based materials have been widely explored as conductive electrodes for printed electronics, including electronic and optoelectronic devices, sensors, and ene...

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Veröffentlicht in:Advanced science 2023-07, Vol.10 (19), p.e2207174-n/a
Hauptverfasser: Wu, Zhiyun, Liu, Shuiren, Hao, Zijuan, Liu, Xuying
Format: Artikel
Sprache:eng
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Zusammenfassung:MXenes emerging as an amazing class of 2D layered materials, have drawn great attention in the past decade. Recent progress suggest that MXene‐based materials have been widely explored as conductive electrodes for printed electronics, including electronic and optoelectronic devices, sensors, and energy storage systems. Here, the critical factors impacting device performance are comprehensively interpreted from the viewpoint of contact engineering, thereby giving a deep understanding of surface microstructures, contact defects, and energy level matching as well as their interaction principles. This review also summarizes the existing challenges of MXene inks and the related printing techniques, aiming at inspiring researchers to develop novel large‐area and high‐resolution printing integration methods. Moreover, to effectually tune the states of contact interface and meet the urgent demands of printed electronics, the significance of MXene contact engineering in reducing defects, matching energy levels, and regulating performance is highlighted. Finally, the printed electronics constructed by the collaborative combination of the printing process and contact engineering are discussed. From a viewpoint of the contact engineering, this review summarizes the critical factors impacting device performance in MXene‐based printed electronics. The significance of MXene contact engineering in reducing interfacial defects, matching energy levels, and regulating performance is highlighted. The application scenarios of MXene contact engineering in printing electronics and the current challenges and future perspectives are discussed.
ISSN:2198-3844
2198-3844
DOI:10.1002/advs.202207174