3D alignment of distant patterns with deep-subwavelength precision using metasurfaces

Measurement of the relative positions of two objects in three dimensions with sub-nanometer precision is essential to fundamental physics experiments and applications such as aligning multi-layer patterns of semiconductor chips. Existing methods, which rely on microscopic imaging and registration of distant patterns, lack the required accuracy and precision for the next generation of three-dimensional (3D) chips. Here we show that 3D misalignment between two distant objects can be measured using metasurface alignment marks, a laser, and a camera with sub-nanometer precision. Through simulations, we demonstrate that the shot noise-limited precisions of the lateral and axial misalignments between the marks are λ 0 /50, 000 and λ 0 /6, 300 ( λ 0 : laser’s wavelength), respectively. With its high precision and simplicity, the technique enables the next generation of 3D-integrated optical and electronic chips and paves the way for developing cost-effective and compact sensors relying on sub-nanometer displacement measurements. Metasurface alignment marks enable precise 3D measurement of relative positions of distant objects using only a laser and a camera, achieving sub-nanometer precision. Applications include 3D chips manufacturing and displacement sensors.