Proposed checklist for the implementation of the SMT component assembly process

The manufacture of electronic products has evolved significantly over time: it began with Wire Assembly, passed through THT (Through Hole Technology) with the emergence of Printed Circuit Boards, and reached SMT (Surface Mount Technology), following the trend towards the miniaturization of electronic components. The complete SMT production process generally consists of three distinct stages: the application of solder paste, the positioning of components and solder reflow to electrically connect the components to the board. It is a process of assembling electronic components directly onto the surface of a printed circuit board (PCB), an automatic process that enables the production of electronic boards at high speed and precision. The manufacture of electronic boards using surface mount technology is the most up-to-date, even more so with the advent of Industry 4.0, which is increasingly raising the level of investment required to purchase the equipment/machines that make up a fully automated assembly line. However, it is common to find inefficient SMT lines, increasing manufacturing costs. In this context, this paper aims to present SMT equipment in the electronic board assembly sector, an efficient implementation system, considering everything from Design for Manufacturing (DFM) to Start Up, including Technical Information on the Board and the Components to be inserted into it, through the Programming of Assembly Equipment.