Effects of trench profile and self-aligned ion implantation on electrical characteristics of 1.2 kV 4H-SiC trench MOSFETs using bottom protection p-well

The effects of a trench profile and self-aligned ion implantation on the electrical characteristics of 1.2 kV 4H-SiC trench MOSFETs employing a bottom protection p-well (BPW) were investigated to improve blocking capability by simulation studies. The trench profile and thickness of a SiO2 spacer during self-aligned ion implantation for BPW affect electrons flow through a trench gate as well as E-field concentration at the gate insulator on a trench bottom. At trench angle higher than 84° and a SiO2 spacer thicker than 0.2 µm showed that the Al concentration penetrated into the trench sidewall during ion implantation is less than 0.3% in comparison with the background doping concentration in a drift region. Under the optimum conditions with a trench angle of 90° and 0.2-µm-thick SiO2 spacer, a high breakdown voltage of 1.45 kV with a low E-field peak in the gate insulator was achieved.