Magnet-free uniform sputtering of dielectric film by RF and microwave power superposition
A novel sputtering device that is free of magnets (magnet-free surface wave sputtering plasma: MF-SSP) is developed by combining a surface wave plasma and RF bias power. Low-pressure (
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| Veröffentlicht in: | Japanese Journal of Applied Physics 2016-08, Vol.55 (8), p.86202 |
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| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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| Zusammenfassung: | A novel sputtering device that is free of magnets (magnet-free surface wave sputtering plasma: MF-SSP) is developed by combining a surface wave plasma and RF bias power. Low-pressure ( |
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| ISSN: | 0021-4922 1347-4065 |
| DOI: | 10.7567/JJAP.55.086202 |