Fabrication of carbon nanotube bump interconnects for flexible multilayer substrates
Bump-shaped vertically aligned carbon nanotubes were fabricated as bump interconnect structures on flexible substrates for flexible multilayer substrates. These structures were bonded and transferred by the surface activated bonding method. In this paper, the fabrication process and mechanical prope...
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| Veröffentlicht in: | Japanese Journal of Applied Physics 2015-03, Vol.54 (3), p.30205-1-030205-4 |
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| container_end_page | 1-030205-4 |
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| container_issue | 3 |
| container_start_page | 30205 |
| container_title | Japanese Journal of Applied Physics |
| container_volume | 54 |
| creator | Fujino, Masahisa Hidenori, Terasaka Suga, Tadatomo |
| description | Bump-shaped vertically aligned carbon nanotubes were fabricated as bump interconnect structures on flexible substrates for flexible multilayer substrates. These structures were bonded and transferred by the surface activated bonding method. In this paper, the fabrication process and mechanical properties of these structures are reported. |
| doi_str_mv | 10.7567/JJAP.54.030205 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_cross</sourceid><recordid>TN_cdi_crossref_primary_10_7567_JJAP_54_030205</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>1685773556</sourcerecordid><originalsourceid>FETCH-LOGICAL-c446t-f99102b27c548b11f2d39dc2ab42ea6f06e160f82b93bafa453009c78a5868003</originalsourceid><addsrcrecordid>eNp1kM9LwzAYhoMoOKdXzz0OoTW_2x7HcOoY6GGeQ5IlkNI2NUnB_fd2dEc9fe8Hz_vB9wDwiGBRMl4-73brz4LRAhKIIbsCC0RomVPI2TVYQIhRTmuMb8FdjM20ckbRAhy2UgWnZXK-z7zNtAxqSr3sfRqVydTYDZnrkwna973RKWbWh8y25sep1mTd2CbXypMJWRxVTEEmE-_BjZVtNA-XuQRf25fD5i3ff7y-b9b7XFPKU27rGkGscKkZrRRCFh9JfdRYKoqN5BZygzi0FVY1UdJKygiEtS4rySpeQUiWYDXfHYL_Hk1MonNRm7aVvfFjFIhXrCwJY3xCixnVwccYjBVDcJ0MJ4GgOOsTZ32CUTHrmwpPc8H5QTR-DP30yf_w6g-4aeRwhsgFE8PRkl-6FH4k</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>1685773556</pqid></control><display><type>article</type><title>Fabrication of carbon nanotube bump interconnects for flexible multilayer substrates</title><source>IOP Publishing Journals</source><source>Institute of Physics (IOP) Journals - HEAL-Link</source><creator>Fujino, Masahisa ; Hidenori, Terasaka ; Suga, Tadatomo</creator><creatorcontrib>Fujino, Masahisa ; Hidenori, Terasaka ; Suga, Tadatomo</creatorcontrib><description>Bump-shaped vertically aligned carbon nanotubes were fabricated as bump interconnect structures on flexible substrates for flexible multilayer substrates. These structures were bonded and transferred by the surface activated bonding method. In this paper, the fabrication process and mechanical properties of these structures are reported.</description><identifier>ISSN: 0021-4922</identifier><identifier>EISSN: 1347-4065</identifier><identifier>DOI: 10.7567/JJAP.54.030205</identifier><identifier>CODEN: JJAPB6</identifier><language>eng</language><publisher>The Japan Society of Applied Physics</publisher><subject>Activated ; Alignment ; Bonding ; Carbon nanotubes ; Interconnections ; Mechanical properties ; Multilayers ; Surface chemistry</subject><ispartof>Japanese Journal of Applied Physics, 2015-03, Vol.54 (3), p.30205-1-030205-4</ispartof><rights>2015 The Japan Society of Applied Physics</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c446t-f99102b27c548b11f2d39dc2ab42ea6f06e160f82b93bafa453009c78a5868003</citedby><cites>FETCH-LOGICAL-c446t-f99102b27c548b11f2d39dc2ab42ea6f06e160f82b93bafa453009c78a5868003</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://iopscience.iop.org/article/10.7567/JJAP.54.030205/pdf$$EPDF$$P50$$Giop$$H</linktopdf><link.rule.ids>314,780,784,27924,27925,53846,53893</link.rule.ids></links><search><creatorcontrib>Fujino, Masahisa</creatorcontrib><creatorcontrib>Hidenori, Terasaka</creatorcontrib><creatorcontrib>Suga, Tadatomo</creatorcontrib><title>Fabrication of carbon nanotube bump interconnects for flexible multilayer substrates</title><title>Japanese Journal of Applied Physics</title><addtitle>Jpn. J. Appl. Phys</addtitle><description>Bump-shaped vertically aligned carbon nanotubes were fabricated as bump interconnect structures on flexible substrates for flexible multilayer substrates. These structures were bonded and transferred by the surface activated bonding method. In this paper, the fabrication process and mechanical properties of these structures are reported.</description><subject>Activated</subject><subject>Alignment</subject><subject>Bonding</subject><subject>Carbon nanotubes</subject><subject>Interconnections</subject><subject>Mechanical properties</subject><subject>Multilayers</subject><subject>Surface chemistry</subject><issn>0021-4922</issn><issn>1347-4065</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2015</creationdate><recordtype>article</recordtype><recordid>eNp1kM9LwzAYhoMoOKdXzz0OoTW_2x7HcOoY6GGeQ5IlkNI2NUnB_fd2dEc9fe8Hz_vB9wDwiGBRMl4-73brz4LRAhKIIbsCC0RomVPI2TVYQIhRTmuMb8FdjM20ckbRAhy2UgWnZXK-z7zNtAxqSr3sfRqVydTYDZnrkwna973RKWbWh8y25sep1mTd2CbXypMJWRxVTEEmE-_BjZVtNA-XuQRf25fD5i3ff7y-b9b7XFPKU27rGkGscKkZrRRCFh9JfdRYKoqN5BZygzi0FVY1UdJKygiEtS4rySpeQUiWYDXfHYL_Hk1MonNRm7aVvfFjFIhXrCwJY3xCixnVwccYjBVDcJ0MJ4GgOOsTZ32CUTHrmwpPc8H5QTR-DP30yf_w6g-4aeRwhsgFE8PRkl-6FH4k</recordid><startdate>20150301</startdate><enddate>20150301</enddate><creator>Fujino, Masahisa</creator><creator>Hidenori, Terasaka</creator><creator>Suga, Tadatomo</creator><general>The Japan Society of Applied Physics</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20150301</creationdate><title>Fabrication of carbon nanotube bump interconnects for flexible multilayer substrates</title><author>Fujino, Masahisa ; Hidenori, Terasaka ; Suga, Tadatomo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c446t-f99102b27c548b11f2d39dc2ab42ea6f06e160f82b93bafa453009c78a5868003</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2015</creationdate><topic>Activated</topic><topic>Alignment</topic><topic>Bonding</topic><topic>Carbon nanotubes</topic><topic>Interconnections</topic><topic>Mechanical properties</topic><topic>Multilayers</topic><topic>Surface chemistry</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Fujino, Masahisa</creatorcontrib><creatorcontrib>Hidenori, Terasaka</creatorcontrib><creatorcontrib>Suga, Tadatomo</creatorcontrib><collection>CrossRef</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Japanese Journal of Applied Physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Fujino, Masahisa</au><au>Hidenori, Terasaka</au><au>Suga, Tadatomo</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Fabrication of carbon nanotube bump interconnects for flexible multilayer substrates</atitle><jtitle>Japanese Journal of Applied Physics</jtitle><addtitle>Jpn. J. Appl. Phys</addtitle><date>2015-03-01</date><risdate>2015</risdate><volume>54</volume><issue>3</issue><spage>30205</spage><epage>1-030205-4</epage><pages>30205-1-030205-4</pages><issn>0021-4922</issn><eissn>1347-4065</eissn><coden>JJAPB6</coden><abstract>Bump-shaped vertically aligned carbon nanotubes were fabricated as bump interconnect structures on flexible substrates for flexible multilayer substrates. These structures were bonded and transferred by the surface activated bonding method. In this paper, the fabrication process and mechanical properties of these structures are reported.</abstract><pub>The Japan Society of Applied Physics</pub><doi>10.7567/JJAP.54.030205</doi><tpages>4</tpages><oa>free_for_read</oa></addata></record> |
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| ispartof | Japanese Journal of Applied Physics, 2015-03, Vol.54 (3), p.30205-1-030205-4 |
| issn | 0021-4922 1347-4065 |
| language | eng |
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| source | IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link |
| subjects | Activated Alignment Bonding Carbon nanotubes Interconnections Mechanical properties Multilayers Surface chemistry |
| title | Fabrication of carbon nanotube bump interconnects for flexible multilayer substrates |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-29T09%3A00%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Fabrication%20of%20carbon%20nanotube%20bump%20interconnects%20for%20flexible%20multilayer%20substrates&rft.jtitle=Japanese%20Journal%20of%20Applied%20Physics&rft.au=Fujino,%20Masahisa&rft.date=2015-03-01&rft.volume=54&rft.issue=3&rft.spage=30205&rft.epage=1-030205-4&rft.pages=30205-1-030205-4&rft.issn=0021-4922&rft.eissn=1347-4065&rft.coden=JJAPB6&rft_id=info:doi/10.7567/JJAP.54.030205&rft_dat=%3Cproquest_cross%3E1685773556%3C/proquest_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=1685773556&rft_id=info:pmid/&rfr_iscdi=true |