Fabrication of carbon nanotube bump interconnects for flexible multilayer substrates

Fabrication of carbon nanotube bump interconnects for flexible multilayer substrates

Bump-shaped vertically aligned carbon nanotubes were fabricated as bump interconnect structures on flexible substrates for flexible multilayer substrates. These structures were bonded and transferred by the surface activated bonding method. In this paper, the fabrication process and mechanical prope...

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Veröffentlicht in:Japanese Journal of Applied Physics 2015-03, Vol.54 (3), p.30205-1-030205-4
Hauptverfasser: Fujino, Masahisa, Hidenori, Terasaka, Suga, Tadatomo
Format: Artikel
Sprache:eng
Schlagworte:
Activated
Alignment
Bonding
Carbon nanotubes
Interconnections
Mechanical properties
Multilayers
Surface chemistry
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Zusammenfassung:Bump-shaped vertically aligned carbon nanotubes were fabricated as bump interconnect structures on flexible substrates for flexible multilayer substrates. These structures were bonded and transferred by the surface activated bonding method. In this paper, the fabrication process and mechanical properties of these structures are reported.
ISSN:0021-4922
1347-4065
DOI:10.7567/JJAP.54.030205