Ru/WN x Bilayers as Diffusion Barriers for Cu Interconnects

Ru/WN x Bilayers as Diffusion Barriers for Cu Interconnects

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Veröffentlicht in:Japanese Journal of Applied Physics 2011-05, Vol.50 (5S1), p.5
Hauptverfasser: Sari, Windu, Eom, Tae-Kwang, Choi, Sang-Hyeok, Kim, Soo-Hyun
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container_issue 5S1
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container_title Japanese Journal of Applied Physics
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creator Sari, Windu
Eom, Tae-Kwang
Choi, Sang-Hyeok
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doi_str_mv 10.7567/JJAP.50.05EA08
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source IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link
title Ru/WN x Bilayers as Diffusion Barriers for Cu Interconnects
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