Hole mobility improvement in Cu 2 O thin films prepared by the mist CVD method

Hole mobility improvement in Cu 2 O thin films prepared by the mist CVD method

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Veröffentlicht in:Applied physics express 2019-05, Vol.12 (5), p.55509
Hauptverfasser: Ikenoue, Takumi, Kawai, Toshikazu, Wakashima, Ryo, Miyake, Masao, Hirato, Tetsuji
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container_issue 5
container_start_page 55509
container_title Applied physics express
container_volume 12
creator Ikenoue, Takumi
Kawai, Toshikazu
Wakashima, Ryo
Miyake, Masao
Hirato, Tetsuji
description
doi_str_mv 10.7567/1882-0786/ab15b3
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source IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link
title Hole mobility improvement in Cu 2 O thin films prepared by the mist CVD method
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