Generation Mechanism of Residual Stress in Laminates during Molding Process

The purpose of this paper is to study the generation mechanism of residual stress in laminates which consist of glass fiber reinforced plastic and copper leaf through the molding. First, a viscoelastic model including not only thermal shrinkage but also plastic deformation is proposed. The generatio...

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Veröffentlicht in:Seikei kakou 1997/08/20, Vol.9(8), pp.645-651
Hauptverfasser: SHIMBO, Minoru, MIYANO, Yasushi, KITAMURA, Teruyuki, NODA, Masayuki, NISHIMURA, Katsuhiko
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Sprache:eng
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Zusammenfassung:The purpose of this paper is to study the generation mechanism of residual stress in laminates which consist of glass fiber reinforced plastic and copper leaf through the molding. First, a viscoelastic model including not only thermal shrinkage but also plastic deformation is proposed. The generation mechanism of residual stress introduced in laminates the during molding process is qualitatively explained by using this viscoelastic model. Second, fundamental equations are derived for the residual stress in laminates during the molding process considering visco-elastic-plastic deformation. With these fundamental equations, the residual stress in laminates are calculated using the characteristics of each component material. Finally, the residual stress in laminates are measured carefully using a layer removal method. By comparing the theoretical and experimental results, the generation mechanism of residual stress generated in laminates during the molding process is discussed.
ISSN:0915-4027
1883-7417
DOI:10.4325/seikeikakou.9.645