Cooling High Power Dissipating Artificial Intelligence (AI) Chips Using Refrigerant

Cooling High Power Dissipating Artificial Intelligence (AI) Chips Using Refrigerant

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Veröffentlicht in:Journal of electronics cooling and thermal control 2024, Vol.13 (2), p.35-49
Hauptverfasser: Mukatash, Waheeb, Kabbani, Hussameddine, Massalt, Jochem Marc, Moscoso, Matthew, Robles, Merari Mejia, Yang, Tyler, Nino, Charlie
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container_end_page 49
container_issue 2
container_start_page 35
container_title Journal of electronics cooling and thermal control
container_volume 13
creator Mukatash, Waheeb
Kabbani, Hussameddine
Massalt, Jochem Marc
Moscoso, Matthew
Robles, Merari Mejia
Yang, Tyler
Nino, Charlie
description
doi_str_mv 10.4236/jectc.2024.132002
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title Cooling High Power Dissipating Artificial Intelligence (AI) Chips Using Refrigerant
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