A Novel Body‐tied Silicon‐On‐Insulator(SOI) n‐channel Metal‐Oxide‐Semiconductor Field‐Effect Transistor with Grounded Body Electrode
A novel body‐tied silicon‐on‐insulator(SOI) n‐channel metal‐oxide‐semiconductor field‐effect transistor with grounded body electrode named GBSOI nMOSFET has been developed by wafer bonding and etch‐back technology. It has no floating body effect such as kink phenomena on the drain current curves, si...
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Veröffentlicht in: | ETRI journal 1996-01, Vol.17 (4), p.1-12 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | A novel body‐tied silicon‐on‐insulator(SOI) n‐channel metal‐oxide‐semiconductor field‐effect transistor with grounded body electrode named GBSOI nMOSFET has been developed by wafer bonding and etch‐back technology. It has no floating body effect such as kink phenomena on the drain current curves, single‐transistor latch and drain current overshoot inherent in a normal SOI device with floating body. We have characterized the interface trap density, kink phenomena on the drain current (IDS‐VDS) curves, substrate resistance effect on the IDS‐VDS curves, subthreshold current characteristics and single transistor latch of these transistors. We have confirmed that the GBSOI structure is suitable for high‐speed and low‐voltage VLSI circuits. |
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ISSN: | 1225-6463 2233-7326 |
DOI: | 10.4218/etrij.96.0196.0041 |